Fixed some routing issues for better Ground connections

Author: corndog2000

Footprint Downloads/FH34SRJ-12S-0.5SH_50_/HRS_FH34SRJ-12S-0.5SH_50_.kicad_mod

@@ -153,18 +153,32 @@
     (stroke (width 0.127) (type solid)) (layer "F.Fab") (tstamp 0ae76c31-858b-4984-913b-b250c4fdbc8d))
   (fp_circle (center 2.75 -2.55) (end 2.85 -2.55)
     (stroke (width 0.2) (type solid)) (fill none) (layer "F.Fab") (tstamp 4cffd1e8-103f-473e-96b1-bbe49aa63c60))
-  (pad "1" smd rect (at 2.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 2e36260d-ffdb-4766-8e21-0a12d79c75e1))
-  (pad "2" smd rect (at 2.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp f0f02b8b-f42a-4b75-a469-10861990714d))
-  (pad "3" smd rect (at 1.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 3c44f7b7-1380-4b24-9191-b17d03a5154d))
-  (pad "4" smd rect (at 1.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 30c0ad73-b047-4523-b9e3-1fce874c3825))
-  (pad "5" smd rect (at 0.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 60c32214-2763-4b09-9903-3c96357263e1))
-  (pad "6" smd rect (at 0.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 995fb6c5-31ec-46be-8d16-051b7afcb909))
-  (pad "7" smd rect (at -0.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp d7a6747f-9099-49fd-a26c-6db1677d6f58))
-  (pad "8" smd rect (at -0.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 455874ce-6632-48e1-bbd3-8b038905d162))
-  (pad "9" smd rect (at -1.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp c2ba9b82-f5b4-40ad-ac0c-e248abcad953))
-  (pad "10" smd rect (at -1.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 2e51c90a-49ea-484a-8234-a94564c8700b))
-  (pad "11" smd rect (at -2.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp 2eebd473-6ff3-493c-8885-773a299aeff7))
-  (pad "12" smd rect (at -2.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask") (tstamp e1b23bc0-eacd-4e9b-8dbd-504b76591c5d))
-  (pad "S1" smd rect (at 3.75 1.25) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp fc7eb3c7-f4af-4579-9dd7-b241803d0103))
-  (pad "S2" smd rect (at -3.75 1.25) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 0ce4cde8-19d0-46a5-9845-3819a962a7f3))
+  (pad "1" smd rect (at 2.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 2e36260d-ffdb-4766-8e21-0a12d79c75e1))
+  (pad "2" smd rect (at 2.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp f0f02b8b-f42a-4b75-a469-10861990714d))
+  (pad "3" smd rect (at 1.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 3c44f7b7-1380-4b24-9191-b17d03a5154d))
+  (pad "4" smd rect (at 1.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 30c0ad73-b047-4523-b9e3-1fce874c3825))
+  (pad "5" smd rect (at 0.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 60c32214-2763-4b09-9903-3c96357263e1))
+  (pad "6" smd rect (at 0.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 995fb6c5-31ec-46be-8d16-051b7afcb909))
+  (pad "7" smd rect (at -0.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp d7a6747f-9099-49fd-a26c-6db1677d6f58))
+  (pad "8" smd rect (at -0.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 455874ce-6632-48e1-bbd3-8b038905d162))
+  (pad "9" smd rect (at -1.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp c2ba9b82-f5b4-40ad-ac0c-e248abcad953))
+  (pad "10" smd rect (at -1.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 2e51c90a-49ea-484a-8234-a94564c8700b))
+  (pad "11" smd rect (at -2.25 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 2eebd473-6ff3-493c-8885-773a299aeff7))
+  (pad "12" smd rect (at -2.75 -1.25) (size 0.3 0.8) (layers "F.Cu" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp e1b23bc0-eacd-4e9b-8dbd-504b76591c5d))
+  (pad "S1" smd rect (at 3.75 1.25) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp fc7eb3c7-f4af-4579-9dd7-b241803d0103))
+  (pad "S2" smd rect (at -3.75 1.25) (size 0.4 0.8) (layers "F.Cu" "F.Paste" "F.Mask")
+    (solder_mask_margin 0.05) (tstamp 0ce4cde8-19d0-46a5-9845-3819a962a7f3))
 )

MicrocontrollerInputModule-backups/MicrocontrollerInputModule-2023-10-14_200519.zip

@@ -16,17 +16,17 @@
     },
     "ratsnest_display_mode": 0,
     "selection_filter": {
-      "dimensions": false,
-      "footprints": false,
-      "graphics": false,
-      "keepouts": false,
-      "lockedItems": false,
-      "otherItems": false,
-      "pads": false,
-      "text": false,
+      "dimensions": true,
+      "footprints": true,
+      "graphics": true,
+      "keepouts": true,
+      "lockedItems": true,
+      "otherItems": true,
+      "pads": true,
+      "text": true,
       "tracks": true,
       "vias": true,
-      "zones": false
+      "zones": true
     },
     "visible_items": [
       0,